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Typical equipment for Lab/Fab

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Semiconductor equipment spare parts in USA . These are only for END USERS. Please contact us for the availability of  the following Semiconductor equipment spare parts in USA .  Subject to prior sale. Appreciate your time! 

1 AB&M.INC UV Flood exposure system Lithography
2 ADT 7910 uno Dicing Saw Packaging
3 Anatech LTD Model SP100 Plasma system Plasma-Asher
4 Anicon LTO CVD CVD System
5 Anneal Tube (4″) Diffusion Furnaces
6 Anodic Bonding Furnace up to 4 Inch Diffusion Furnaces
7 ASM LPCVD CVD System
8 Atomic Layer Deposition (ALD) Deposition
9 BMR Low Temp PECVD CVD System
10 Boron Tube (4″) Diffusion Furnaces
11 Canon i4 4000 Stepper Lithography
12 CHA Mark 50 Evaporation Deposition
13 CHA Thermal evaporation (SEC-600-RAP) (Manual tool) Deposition
14 Cincinnati Sub-Zero Environmental Chamber Packaging
15 Class II Biohazard Safety Hoods Back-End Processing
16 CO2 Water Jacketed Incubator Series II Back-End Processing
17 Dektak 3 Profilometer Characterization
18 Dektak XT Profilometer Characterization
19 Digital Combo Embosser Hot Embossing
20 Dry and Wet Oxidation Tube (6″) Diffusion Furnaces
21 Dry Oxidation Tube (4″) Diffusion Furnaces
22 E-Beam 1 evaporation (Temescal CV-8) (Manual tool) Deposition
23 E-Beam 2 evaporation (Temescal CV-14) (Manual tool) Deposition
24 E-Beam evaporation (Temescal SR-10) (Manual tool) Deposition
25 FEI SEM / E-Beam Writer Lithography
26 Filmetrics F40 Nanospec Characterization
27 First Nano Furnace (EasyTube 3000 System) CVD System
28 Gaertner Ellipsometer Characterization
29 Gasonics Downstream Plasma Ashing Plasma-Asher
30 Harrick Plasma Cleaner Plasma-Asher
31 Heatpulse 610 RTA Diffusion Furnaces
32 Hesse Mechatronics Bondjet 949 Packaging
33 HMDS Oven Lithography
34 HS200 Confocal Microscope / Profiler Characterization
35 Inert Environment Blue M Oven 600 Degree Packaging, Diffusion Furnaces
36 Ion Milling (Manual tool) Dry Etching
37 K&S 780 Dicing Saw Packaging
38 K&S Aluminum Wedge Bonder Packaging
39 K&S Gold Ball Bonder Packaging
40 Karl Suss MA56 Mask Aligner Lithography
41 Karl Suss MA6 Mask Aligner Lithography
42 Karl Suss MJB-3 Mask Aligner Lithography
43 Kasper Mask Aligner model 3001 Lithography
44 Laser Ablation Resonetics X250 Dry Etching
45 Laurell Photoresist Spinner Lithography
46 Mini-Brute Tube (4″) Diffusion Furnaces
47 MVD 100 (Applied MST) Deposition
48 Nano Furnace Tube (2″) Diffusion Furnaces
49 Nano Imprinter Jenoptik Hex03 Hot Embossing
50 Nano Multi-Purpose Furnace (5″) Diffusion Furnaces
51 Oriel UV Flood exposure system Lithography
52 PE 2400 Multi-Purpose Sputtering (Manual tool) Deposition
53 PE 2400 Sputtering (Manual tool) Deposition
54 PE 4400 Sputtering (Manual tool) Deposition
55 PE-100 Plasma Etch Benchtop System Lithography
56 Plasma-Therm PECVD Model 790 CVD System
57 Plasma-Therm RIE Model 790 Dry Etching
58 Quintel Mask Aligner Lithography
59 REY Embosser Hot Embossing
60 Scientific Technology Embosser Hot Embossing
61 SCS PDS 2010 Specialty Parylene Coating System CVD System
62 SEM Hitachi S4700 / EDAX Characterization
63 Sintering Tube (4″) Diffusion Furnaces
64 Solitec Spininer Model 5110-C-TD Lithography
65 Solitec Spinner Model 5110-CT Lithography
66 Solitec Spinner Model 5110-ND Lithography
67 SPTS APS PM Dry Etching
68 STS System DRIE Dry Etching
69 Technics II 500 Plasma-Asher
70 Tencor FLX-2320A Stress measurement tool Characterization
71 Tenney Environmental chamber Packaging
72 Tousimis 815B Series C Characterization
73 Trion ICP/RIE Dry Etching
74 Tylan PVD-1000 CVD System
75 XeF2 Pulsing Etcher Dry Etching
76 Xyztec Sigma Condor Bond Tester Packaging
77 Zeiss Xradia 410 Nano CT Characterization

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