Tystar Standard Processes

Description

Tystar Standard Processes

Thermal Processes
Atmospheric Processes: Anneal Processes: High Temperature Anneal Metal Anneal Oxidation: Wet Oxidation: – Bubbler – Pyrogenic – Drip Feed Flash Vaporization Dry Oxidation Thick Thermal Oxides Silicon Dioxide Resonators Doping Processes: Solid Source Doping: – p-Type – n-Type Liquid Source Doping: – POCl3 – BBr3 Sintering Processes Nano Carbon Material Processes: Carbon Nano Tubes: – Vertically Aligned – Horizontally Aligned Graphenes Optical Fiber Preform Processes (MCVD)	Low Pressure Chemical Vapor Deposition (LPCVD): Silicon Nitride: Low-Stress Stoichiometric High Temperature Oxide (HTO) Low Temperature Oxide (L TO) Silicon Carbide Devices Polycrystalline Silicon Carbide Silicon Nitride Resonators Silicon Dioxide Resonators Silicon Oxynitride (SiN_xO_y) LPCVD SIPOS (Semi-Insulating Polycrystalline Silicon) Epitaxial Silicon Poly Silicon (With DISILANE (Si2H6), With SILANE (SiH4)): Doped Undoped Glass: PSG BPSG TEOS Polycrystalline SiGe Nano Carbon Material Processes: Silicon Nano Wires Carbon Nano Tubes: -Single-Walled -Multi-Walled Graphenes: – Single-Layered – Multi-Layered
Non Thermal Processes	Industry Applications
Photo-Enhanced: Silicon Nitride Silicon Oxide Silicon Oxy Nitride Plasma-Enhanced: Carbon Nano Materials: Carbon Nano Tubes Graphenes Ultra Nano Crystalline Diamond (UNCD) Nano Crystalline Diamond (NCD) Micro Crystalline Diamond (MCD) Single Crystalline Diamond (SCD)	SEMICONDUCTOR DEVICE MANUFACTURING Solar PV (photovoltaic) cells MEMS (Micro Electronic Mechanical Systems) Optical waveguide communications Optical Devices Optical fibers Nano devices and the fabrication of Carbon Nano-Tubes and Nano-Wires