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STS ICP Multiplex

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Description

STS, SPTS ASE Multiplex ICP System, RIE Etch Advanced Silicon Etcher, complete

Location: CA USA.

Valid : It is only for end users and is subject to prior sale without notice. Appreciate your time!

Condition: We sell it at AS IS or complete, working, functional test at extra cost.

Photos: Download.

Info on the system from the owner for your reference.

  • OEM = Surface Technology Systems Limited : STS, SPTS,
    *   Model = MESC Multiplex ICP ASE
    *   Type = ICP RIE (Inductively Coupled Plasma, Reactive Ion Etch)
    *   Description of Process = ASE (Advanced Silicon Etch, Bosch Process)
    *   Wafer Size = 150mm
    *   Loader capacity = 2 wafer Carousel
    *   Chuck Type = Mechanical Weighted Clamp
    *   Process Gases:
    *   C4F8 = 300 SCCMS
    *   SF6 = 600 SCCMS
    *   O2 = 100 SCCMS
    *   AR = 100 SCCMS
    *   MFC’s are Millipore FC2901 Series
    *   Turbo Pump = Leybold Mag 2000 CT
    *   RF Generator 1 = ENI ACG-3
    *   RF Generator 2 = AE RFG 3001 (Advanced Energy)
    *   Vacuum measurement = MKS Instruments
    *   Gate Valve = VAT throttling type gate valve
    *   Slit Valve = VAT Slit Valve
    *   Manuals = STS MESC Multiplex ICP Operator’s and Modular Parts Catalogue
    *   Vacuum Pump Loadlock = Edwards Pump E2M40
    *   Vacuum Pump Process Module = Edwards Pump IQDP80 w/IQMB250 Blower (Intelligent Quiet Interface)
    *   Chiller = Affinity, PWG-060K-BE33CBC2
    *   Support Module = STS Controller Cabinet / AC Breaker Panel

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OEM-25-1-SS380EB-MSP-125000

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