Description
OXFORD Ionfab 300 Plus Ion beam etch and deposition system, 6″-8″. Cassette to cassette.Single wafer possibility.
Reactive Ion Beam Etching (RIBE)
Reactive Ion Beam Deposition (RIBD)
Chemically Assisted Ion Beam Etching (CAIBE)
Ion Beam Sputter Deposition (IBSD)
Ion Assisted Sputter Deposition (IASD)
Cryo pump
Manuals and repair documents
ComputerFlexibility:
Ability to clamp (Shape) and design unique carrier plates
Wafer handling options
Manual loading: One-off trials
Load-lock: Faster trials
Cassette-to-cassette loading / Unloading: Batch production
Clusterable with other process tools
OXFORD INSTRUMENTS Plasma pro plasma etch
Deposition and sputtering tools
FlexAL Atomic Layer Deposition (ALD) tool
Ion source:
Leading ion source and grid set technology
Specific deposition grid sets to suit multiple targets
Full range of etch source options: Up to 35 cm
Dual beam configurations (Etch plus deposition source)
Without exposing process chamber / Wafer to atmosphere
Increased deposition rates: Etch source plasma radical source (IASD)
Flexibility in single tool:
Tiltable substrate holder angle: -90° Up to +75° (Depending upon configuration)
Enables blazed gratings
Allows sidewalls to be cleaned off / Etcher
Angle control: Substrate relative to deposition target
Platen rotation speed:
Variable platen rotation speed enable
Deposition rate controlled specifically: Application
Standard and high speed platen options
Substrate cooling:
Prevents degradation of substrate and devices: Structures / Other materials placed
Options:
Wafer backside cooling with He (Turbo-pump) / Ar (Cryo-pump)
Process monitoring:
Etch endpoint monitoring by SIMS: Multi-material applications
Deposition process monitoring
CRYSTAL Monitor (Single / Dual head)
White light optical monitor (WLOM)
Chamber gas identification
Partial pressure control
Leak checking via RGA
Typical applications and materials:
IR Detectors
CdHgTe (CMT) Etch
VOx Deposition and etch
Metal contact and track etch
Cu, Ni, AI
Noble metals: Au, Pt, Pd
Diffraction gratings
SiO2 blazed etch
Spintronics and MRAM
AR and HR Coatings: Laser bars
TELECOM Filters
III-V Photonics etching
Thin Film Magnetic Hard Disk Heads (TFMH)
(2) Accessories:
E4-10201
E5-30101
ID-OEM-Model-1/2
